Dear all,

I want to bond my PDMS structure (with microfluidic chamber/ channels)
over a Si device. My question is how can I do activation without an
oxygen plasma dedicated equipment.
Can I use a sputtering machine? we have a sputtering with DC/RF source,
and it has a bias to perform the plasma over the substrate (it is used
to clean the surface before deposition). If yes, which gas do you
recommend me to use?

thanks a lot
Laura