I have reason to pattern a wire bond pad on the top of some SU-8 but am
having trouble getting
sufficient adhesion with Ti and Cr to allow for ultrasonic ball bonds of
sufficient strength.

What are other folks doing to make wire bonds to structures build atop
an SU-8 layer?

-- Jon

Jon R. Fox
Principal Scientist, Research Support Instruments, Inc.
Visiting Researcher, Princeton University
fox@researchsupport.com
tel: 732-329-3700 x 103
fax: 732-329-9200