Hi All,

We spent much time in order to test the SU-8 2050 to obtain the
wanted thickness (near 120 microns). We levelled very well our hot
plate and we tested different times, temperatures and exposure times.
The major problem occurs after spin coating process. After spinning,
there are no (or very few) bubbles but we observed non uniform
layer . When we perform the soft bake SU-8 film tends to
"spontaneously" form a number of divots or craters that are not
initially present (after spin-coating). These problems are observed
with or without the use of OMNICOAT both on silicon surface and Cu
seed-layer also at different spin velocities.
Has anyone experienced this problem?

thanks

Simone Marasso
Dipartimento di Fisica - Politecnico di Torino
Laboratorio Materiali e Microsistemi (Chivasso - Torino)
[email protected]
http://www.latemar.polito.it/
http://www.polito.it/micronanotech