Erik, from what you describe below, it sounds like an incompatible CTE as
between the two materials that you are bonding, slow cooling only reduces
the shock not the final stress. Gary

-----Original Message-----
From:   Erik Jung [SMTP:[email protected]]
Sent:   Wednesday, December 13, 2006 8:27 AM
To:     'General MEMS discussion'
Subject:        [mems-talk] Glas Frit Bonding

Dear all,
When bonding Si with glass (borofloat 33) using Ferro FX036 with ~40?m
(prefired) thickness, I don?t obtain good mechanical strength. Same process
with glass/glass and Si/Si works perfectly.
A cooldownrate of less than 13K/min has been used.
Do you have any suggestions here?
Regards!
Erik

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