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MEMSnet Home: MEMS-Talk: Re: SU-8 Adhesion with SiO2
SU-8 Adhesion with SiO2
2006-12-20
Prakash Mukre
2006-12-20
Joseph Grogan
2006-12-21
John Seymour
Re: SU-8 Adhesion with SiO2
2006-12-21
Prakash Mukre
2006-12-21
John Seymour
2006-12-21
Gareth Jenkins
2006-12-21
Sueda Saylan
2006-12-21
Prakash Mukre
Re: SU-8 Adhesion with SiO2
Prakash Mukre
2006-12-21
Thanks for suggetions,
I am using oxide layer as an insulating layer for the subsequent metal
electrodes of Pt and Ag. So can not use any other intermediate layer
which will conduct.

John did you use AP300 on thermal oxide?

Thanks,
Prakash

On 12/20/06, Prakash Mukre  wrote:
> Hi All,
>
> I am trying to deposit SU-8 over thermal oxide. SU-8 is part of the final
> device I am fabricating, so I want it to adhere to the substrate strongly.
> But with my current recipe SU-8 delaminates after development. Following are
> the some process specs I am following.
>
> SU-8 2100 Thickness: 200-250um
> Softbake: 15min @65C,  100min @95C.
> UV Dose: I have tried 400mJ/cm2 to 1000mJ/cm2
> Hard Bake: 5min @65C, 20min @ 95C.
> Development time: 10-20min.
>
> I have tried using primers like HMDS, P20. Also I have tried using Omicoat.
> What could be the possible reason for this? or SU-8 does not adhere to
> thermal oxide at all?
reply
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