Dear friends.
i am working on dicing and structure release for mems based device. In
my case i have to do structure release after dicing. (as force at the
time of dicing may damage cantiliver). thus i am maintaining a 30 um
si at the place where through holes are expected after structure
release.
After dicing i have to release structure. i am having Al metal pads on
top of Si. As a individual chip i cant do any lithography, so in this
case, what should i do?
i am thinking for TMAH etching.
-abhay joshi
university of pune.