Hi all.

Starting from a 200um silicon wafer i need to dice it in order to realize
strips of size 70x2mm.

I'm using a disco dicer (an old model DAD2H/6). Many many of the strips
broke during the dicing process. I think this is due to the fact that
200um wafer is very fragile. I've tried also with a 500um wafer and had
not breaking problems.

Wafer is fixed with respect to dicer chuck with a tape (i don't know which
is the manufacturer). May a wax based fixing method improve cutting
results, and in particular prevent strips breaking ? Do you have any
suggestion in order to prevent breaking of thos silicon strips ?

In dicing operations, i never tried wax fixing: does the cut quality
improves using wax based fixing ? I always used tape beaucose it is a more
practical solution...

Best regards,
Andrea