Hi,
In building my MEMS device, I need to create a sandwich layer of SU8(2050)-Gold-
SU8(2050).  The Gold layer functions as a conductor.  I have been trying to
thermally evaporate either Chromium and/or Titanium to create an adhesion layer
for Gold on SU-8, but the evaporation rates are low.
Does anybody know if Gold adheres well to SU-8 2050 so I can do without an
adhesion layer?  Alternatively, I am considering switching to using Omnicoat as
an adhesion layer for Gold on SU-8 2050 instead.

Mr. Jeffrey Mun Pun YU
Division of Bioengineering
Block E3, #05-18, Nanobioanalytics Lab
9 Engineering Drive 1
National University of Singapore
Singapore 117576
Tel: (65) 65165985, Fax: (65) 68723069
E-mail:  g0500396@nus.edu.sg
Website:  http://www.bioeng.nus.edu.sg/people/trau/Lab_index.htm