Hi,

You may glue the thin wafer with wax or thermal adhesive on a thick wafer and
dice only partially into the thick wafer. To remove the strips after dicing you
heat the whole thing up or you may dissolve the glue in alcohol.  Your wafer
probably breaks because of the softness of your dicing tape.

Good luck!

Michael Zickar

--------------------------------------------
Institute of Microtechnology
University of Neuchatel



-----Original Message-----
From: [email protected] [mailto:[email protected]] On
Behalf Of Andrea Mazzolari
Sent: Samstag, 24. Februar 2007 15:42
To: [email protected]
Subject: [mems-talk] wafer fixing when dicing

Hi all.

Starting from a 200um silicon wafer i need to dice it in order to realize
strips of size 70x2mm.

I'm using a disco dicer (an old model DAD2H/6). Many many of the strips
broke during the dicing process. I think this is due to the fact that
200um wafer is very fragile. I've tried also with a 500um wafer and had
not breaking problems.

Wafer is fixed with respect to dicer chuck with a tape (i don't know which
is the manufacturer). May a wax based fixing method improve cutting
results, and in particular prevent strips breaking ? Do you have any
suggestion in order to prevent breaking of thos silicon strips ?

In dicing operations, i never tried wax fixing: does the cut quality
improves using wax based fixing ? I always used tape beaucose it is a more
practical solution...