Hi All,

I am working on AZ P4620 photoresist with reflow
process. the film thickness is about 6.5um and
softbake at 110C for 2min, after development, I reflow
the patten at 125C for 4min. I checked undermicroscope
and found that the resist did not reflow well and
there are many small holes(like caused by air bubbles)
on the pattern. Does anyone have the same experience?
thank you very much.

Echo