Hi Andrea,

    If you haven't already tried this, you may wish to slow down the cutting
speed (blade traversal rate, not spindle speed).  This can help reduce the
stress on fragile parts.  A fresh blade can also help.  Good luck!

                    Matthew Last


Content-Transfer-Encoding: 8bit
From: "Andrea Mazzolari" 
Precedence: list
MIME-Version: 1.0
To: mems-talk@memsnet..org
Date: Sat, 24 Feb 2007 15:42:02 +0100 (CET)
Reply-To: mazzolari@fe..infn.it, General MEMS discussion 
Message-ID: <4982.151.25.16.181.1172328122.squirrel@smtp.fe.infn.it>
Content-Type: text/plain;charset=iso-8859-1
Subject: [mems-talk] wafer fixing when dicing
Message: 1


Hi all.

Starting from a 200um silicon wafer i need to dice it in order to realize
strips of size 70x2mm.

I'm using a disco dicer (an old model DAD2H/6). Many many of the strips
broke during the dicing process. I think this is due to the fact that
200um wafer is very fragile. I've tried also with a 500um wafer and had
not breaking problems.

Wafer is fixed with respect to dicer chuck with a tape (i don't know which
is the manufacturer). May a wax based fixing method improve cutting
results, and in particular prevent strips breaking ? Do you have any
suggestion in order to prevent breaking of thos silicon strips ?

In dicing operations, i never tried wax fixing: does the cut quality
improves using wax based fixing ? I always used tape beaucose it is a more
practical solution...

Best regards,
Andrea