I proposed a pre-preparation process for silicon/glass wafer for their later
hydrophobic modification which use SAM materials, like OTS.
1. Hydration of wafer: Soak wafer in piranha solution at 100C for 20 mins
2. DI water rinse 10 mins
3. Methanol rinse 10 mins
4. RCA-1 clean with H2O:NH4OH:H2O2 for 15mins
5. Dry with N2 gun

Is this process feasible for the later SAM modification based on your
experience? is it ok for both silicon and glass?

and I also try to compare the hydrophobic results which from SAM modified
sample to the one with PTFE spin coating. But for PTFE spin coating on
silicon/glass, what else need to take care if I take the same process as
above for the pre-preparation?

Thanks a lot!