>From my experience, liftoff becomes more challenging when your minimum
features and spacing become very small (increased pattern density).  For
instance, I found that trying to make 10 micron metal lines that are
separated by 10 microns spacing via liftoff was quite difficult.  When I did
the same design and used etching (actually, the mask would be the inverse of
the liftoff mask) I got much better results.  I'm not sure what kind of
pattern density you will have, and I believe there are ways to optimize the
liftoff process, but the quickest solution might be to do the etching.

To follow up on the comment from Nicolas, I also agree that using the
evaporator to deposit 1 micron of metal might be challenging.  As mentioned,
you may see cracks in your film or it might completely peel off (depends on
the metal and the substrate).

Michael Rust

-----Original Message-----
From: [email protected]
[mailto:[email protected]]On Behalf Of Yitian Peng
Sent: Saturday, March 03, 2007 4:46 PM
To: [email protected]
Subject: [mems-talk] etch gold or lift-off?

Please give some advice:
I want to fabricate the patterned gold on quartz substrate.
But the thickness of the gold is more than 1micro,
the minimum dimension of the pattern is 10 micro.
What process Should I use?? etch gold or lift-off,
Is there some problems about the two kinds of process??