Hi all,
i need to dice (111) silicon wafers 500um thick.
I want to obtain very thin strips of size 5 um x 500 um x 70mm!
My current dicing procedure is as follow:
1) temporary bonding of silicon wafer to be diced to another silicon wafer
used as substrate
2) dicing of the wafer
3) release of silicon strips

With this process i can obtain strips of size 50 um x 500 um x 70mm, any
idea to improve dicing process and obtain thinner strips.

I'm currently using blades with grit 2000, may a greatest grid (smaller
grain size help) ?

Best regards,
Andrea.