Hi Xinhua,
Those are your two best options. Cr is higher stress, but resists acids
(like HF) better. Ti is lower stress, but is eaten away quite quickly by
acids like piranha and HF.
It depends on what other processes you're doing with the substrate.

Jesse Fowler



"Xinhua Zang"  writes:

Subject [mems-talk] Adhesion Layer for Ag and Al

Hi All,

Recently I evaporated Al and Ag onto a silicon substrate with thermal
oxide.
I did not use any adhesion layer. Al layer seems to be ok, but Ag layer is
peeling off. Could some body suggest an adhesion layer for Ag like Cr or
Ti.