1) Use adhesion layer first (APS3000)
2) Use nitrogen oven or vacuum oven to hardbake BCB, otherwise it will be
oxidized.
Good luck
J.J. Wang

Qasem Ramadan  wrote: Hello,

I am trying to use BCB as a mold for my Ni electroplating on Cu seed layer.
After the hard baking I realize that the BCB ( 10 um thick) completely pill
off (very poor adhesion).  Any suggestion?