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MEMSnet Home: MEMS-Talk: Au electroplating
Au electroplating
2007-05-09
kris
2007-05-09
David Nemeth
2007-05-10
Shay Kaplan
2007-05-10
P.E.M. Kuijpers
2007-05-10
David Nemeth
2007-05-10
David Roberts
2007-05-11
P.E.M. Kuijpers
2007-05-11
David Roberts
2007-05-14
P.E.M. Kuijpers
Miniature Hot Press for Plastic Microdevice bonding
2007-05-14
Heiko van der Linden
2007-05-14
David Roberts
2007-05-14
Mo Kebaili
Au electroplating
David Roberts
2007-05-11
Hi Peter,
A new E-less Ni shouldn't fire off (outplate).  Where does the fire off
occur? Everywhere, or only on your heater? Indirect heat should be used.
Regards,
Dave Roberts (Wafer Plating Specialist)
Prodigy Surface Tech.  Santa Clara, CA

-----Original Message-----
From: P.E.M. Kuijpers [mailto:p.e.m.kuijpers@philips.com]
Sent: Thursday, May 10, 2007 11:24 PM
To: General MEMS discussion
Subject: RE: [mems-talk] Au electroplating

Hello Dave,

Another question about wafer plating:
We did install ENIG (Eletroless Nickel/Immersion Gold, Rohm and Haas
chemicals).
After Nickel plating we observed outplating of our Ni bath? We do have N2
bubbling in our bath for extra agitation.
Is there another simple solution to avoid this outplating?
reply
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