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MEMSnet Home: MEMS-Talk: Au electroplating
Au electroplating
2007-05-09
kris
2007-05-09
David Nemeth
2007-05-10
Shay Kaplan
2007-05-10
P.E.M. Kuijpers
2007-05-10
David Nemeth
2007-05-10
David Roberts
2007-05-11
P.E.M. Kuijpers
2007-05-11
David Roberts
2007-05-14
P.E.M. Kuijpers
Miniature Hot Press for Plastic Microdevice bonding
2007-05-14
Heiko van der Linden
2007-05-14
David Roberts
2007-05-14
Mo Kebaili
Au electroplating
P.E.M. Kuijpers
2007-05-14
Hi Dave,

Outplating is mainly on the heater element/holder (we do use direct
heating)
and also on the bottom/sidewalls of the tank.
According to R&H, this is caused by roughning of the tank

Can you also give some suggestion/guidelines to maintain the bath?

Thanks,

Peter Kuijpers
MiPlaza
DTS/TFF
High Tech Campus 04
Room: WAGp5-11
5656 AE Eindhoven
The Netherlands

Phone.:  (+31 40 27) 98904 (mobex)
mobile:(+31) 06-12507027
fax.:     [+31 40 27) 44769
mailto:p.e.m.kuijpers@philips.com


"David Roberts"  writes:
Subject RE: [mems-talk] Au electroplating Classification

Hi Peter,
A new E-less Ni shouldn't fire off (outplate).  Where does the fire off
occur? Everywhere, or only on your heater? Indirect heat should be used.
Regards,
Dave Roberts (Wafer Plating Specialist)
Prodigy Surface Tech.  Santa Clara, CA
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