A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: Au electroplating
Au electroplating
2007-05-09
kris
2007-05-09
David Nemeth
2007-05-10
Shay Kaplan
2007-05-10
P.E.M. Kuijpers
2007-05-10
David Nemeth
2007-05-10
David Roberts
2007-05-11
P.E.M. Kuijpers
2007-05-11
David Roberts
2007-05-14
P.E.M. Kuijpers
Miniature Hot Press for Plastic Microdevice bonding
2007-05-14
Heiko van der Linden
2007-05-14
David Roberts
2007-05-14
Mo Kebaili
Au electroplating
Mo Kebaili
2007-05-14
Hi kris,

Use reverse pulse electroplating to minimize stress.

Regards,

Mo kebaili

-----Original Message-----
From: kris
To: mems-talk@memsnet.org
Subject: [mems-talk] Au electroplating

Hello All,

IS there a method to produce stress free Au
electroplated structures??

I am using sulphite bath and 1.5mA/cm^2 of the current
density. Ni is used as the seed layer.

Please let me know your suggestions.
reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
The Branford Group
Addison Engineering
MEMS Technology Review
Harrick Plasma, Inc.