Dear collegues,

I wonder if anyone of you ever used the photodefinable silicone
WL-5150 (Dow Corning) for waferbonding at low temperature.
Any advise is highly appreciated.
Best regards
Peter Svasek

--
Vienna University of Technology
Institute of Sensor and Actuator Systems
Gusshausstrasse 27-29/366
A-1040 Vienna
Austria

Tel. +43-1-58801-36643
Fax  +43-1-58801-36699