Inquiry regarding sidewall deposition of wafers
in e-beam metalization
shay kaplan
2007-06-26
In ebeam evaporation, the process is a line of site process. i.e. the atoms
/ molecules fly on a straight line from the source to the surface. For these
reason, the thickness is proportional to the cosine of the angle. A 90 deg
wall will not get coated. However, in some systems the wafers are tilted and
are rotating during evaporation (planetary fixture). In such a system one
get can some material on the sidewall depending on the system geometry
shay
-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of polly
Sent: Tuesday, June 26, 2007 9:58 PM
To: mems_talk
Subject: [mems-talk] Inquiry regarding sidewall deposition of wafers in
e-beam metalization
Dear Sir,
i would like to know if in e-beam metallization, the sidewall (300 micron
thickness face) also get coated with metal(Aluminum). Kindly also refer me
some good tutorial materials in the metalization area.