Dear colleagues

I met pure adhesion between SU8 and Cu seed layer, it peels off or hump
locally when I plate NiP through SU8 pattern. Anyone have solutions for
this problem?

I am trying to use ITO seed layer. Do you think it is ok? Will ITO react
with the H3PO4 or H3PO3 in the plating bath?

Any comments and suggestions are highly appreciated in advance.

Thank you & have a nice day!
Best regards!

Dr. Zhang XiaoQiang
Singapore-MIT Alliance
Department of Materials Science and Engineering
National University of Singapore