I am using photo lithography resist as the mask to etch SiO2 to create a
rectangular feater on a silicon with DLC overcoat, i.e. the layer structure
goes Si, DLC, SiO2, resist.  The thickness of SiO2 is around 400A.  When we
do RIE etch in a STS tools, we see redep indicated by "horns" sticking up on
the side of the walls.
I am trying to figure out how this can be avoided.

Thanks,

Mike