Hi,
I am attempting a lift-off technique to pattern gold.  I have patterned 7-8um of
AZ9260 on SiO2 wafers and evaporated 10nm Chromium followed by 300nm Gold
through the patterns in the AZ9260 resist.  Subsequently I have lifted off most
of the resist by soaking the wafers in Acetone over 2 days.  However I have
noticed that there are some resist residue that won't be lift-off even after
sonication.  The sonication process also leaves a lot of debris on the wafer.
I am trying to remove these debris and the remaining residue by soaking the
wafers overnight in AZ300T Stripper.  Does anyone have an alternative technique
to suggest to clean the wafers?  I have tried using H2SO4:H2O2 = 3:1 (piranha)
by it may damage by structures, so I refrain from using this technique.

Thanks a bunch!

Jeffrey