Hi All,

I deposited Aluminum and gold metals using CHA evaporator with thickness
Ti/Al ( 300A/3000A) and Ti/Au(300A/3000A)
Power applied for Al: 36% and Au: 37%. But, I obtained the film
thickness of ~4700A when I measured using the profiler.
I replaced with the new crystal before film depositions.

Can anyone suggest, what other parameters I have to take care for
accurate film thickness deposition in the evaporator.

Best Regards,
Ramakrishnna.