Hi All,
       I have cured my sample and attached the die to
Chip carrier made up of hybrid ceramic package using
TRA-BOND 2151 epoxy (thermal epoxy). Now I want to
remove the die from the chip carrier. Let me know, if
there is any solution we need to use to unsecure the
die from the chip carrier, which is attached by
TRA-BOND 2151 epoxy.

Thanks

Regards,
Madhav.