Hello All:
    I am having difficulty in etching a silicon oxide layer that I deposited in
a Plasma therm system with Silane and Nitrous oxide. Thickness is about 8000 A.
It etches really fast (about 30 seconds) in 5:1 BOE, but doesn’t etch at
all in a dry etch system. I am using Oxygen and CHF3 for etching. I have tried
various gas ratios, power and pressure settings, but I am not able to etch this
layer. I need to use a dry etch for my application. Any suggestions about etch
or deposition is appreciated.
     Thanks
  Deepa