I'm not familiar with the MTS 8800.

On the coat equipment I've used, there is a nozzle which shoots solvent
onto the back of the wafer as one of the final steps.

Without this, I don't think it would be possible to prevent resist
contamination on the back of the wafer and maintain process latitude of
the machine.

dbp

Edward Sebesta wrote:
> I have an MTS 8800 with splashback problems, that is photo resist
> redopositing on to the back side of the wafers.
>
> I have check the exhaust and made sure it was the maximum. I have tried
> recipe modifications with lower acceleration for the resist spin step.
> These are the standard causes for the problem.
>
> I would like to know the following.
>
> 1. Does anyone have a contact for persons manufacturing retrofit resist
> spin bowls?
>
> 2. Does anyone have a fix for this or suggestions.