Aluminum is fairly impervious to CF4. AlF3 isn't volatile at all. So you
could us it or Al2O3. You should avoid heat and do the deposition cold
so the Al won't react with your quartz.

I would look down the periodic table for other metals with involitle
fluorides.

I am not sure why you don't use resist for this. If you are in a SiO2
etch mode, with no O2 added, and maybe a little H2 or CHF3, the resist
should be fairly resistant, though I am not sure it would be good for 10
microns.

My 2 cents worth.

Ed

-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org] On Behalf Of Sreemanth M Uppuluri
Sent: Monday, October 01, 2007 8:25 PM
To: mems-talk@memsnet.org
Subject: [mems-talk] Quartz etching using RIE

Hello All,

I am trying to etch quartz by Deep-RIE process. The etch depth I need is
around 10 microns. Can anyone please suggest a recipe for this. I have
tried using Cr/Ni mask (Ni thickness of 70 nm) with CF4. But nickel got
etched very fast and the maximum etch depth obtainable is around 1.5
microns.