Hello all,

We have a flip chip bonder (Research Devices  M8) that was donated to our
group more than a year ago. It does bond fine but with some misalignment
between the bonded pieces.
I could bond with the inverse offset, but I would rather use the calibration
capability available in the machine. Unfortunately nobody around exactly
knows how to do this.  It is an old machine and the story is the same old.
Manufacturer is not around any more and instructions are more like for
somebody who has been trained or at least seen a demonstration.

I appreciate if anyone who had gone through this procedure on this
particular flip chip bonder gets in touch with me, especially if she/he is
around NY.

Best,

Serhan Ardanuc
SonicMEMS Laboratory
Cornell University