Looks like either there is not enough developer on the wafer or the rinse
cycle is not good or both. The rinse water must be applied when the
developer is still on. Don't save on rinse time.

shay

-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of Sadhana Patil
Sent: Friday, October 05, 2007 7:45 PM
To: [email protected]
Subject: [mems-talk] fudging/spreading around the PR features

I am new to Photolithography. I am doing Photolithography with S1813.
Many a times I get fudging/spreading of photoresist around the edge of
the photoresist features after developing. They look more or less like
threads spreading outward from the feature.
Does anyone know what am I doing wrong?