Hi Andrea,
People usually avoid using the areas close to the scribes dew to these
problems. If you have to, an colleague has recently showed me a paper
regarding reflow of silicon in 1100 C, hydrogen atmosphere at ~10 torr. If
you have the equipment and brave enough to try, it should work.
Shay

-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of Andrea Mazzolari
Sent: Saturday, October 06, 2007 11:11 AM
To: [email protected]
Subject: [mems-talk] lattice damage removal with thermal cycles.

Hi all,
for my application i need to dice silicon strips of size 20x70mm. Starting
material is (110) silicon wafer 0.5mm thick.

Dicing induces lattice damage. Using etch pitch dislocations etchants i
determined that there is a strong damaged zone near the cut, damaged zone
extend for a thickness of about 100um, and decrease far from the cut.

I know that thermal cycles are used to remove lattice damage and improve
lattice quality, but i don't have any experience in this field.

Could thermal cycles be useful for removal of lattice damaged induced in
dicing operations ? Any suggestion or starting point ?