The deposited layer would be roughly 2-5 times thinner than the height
of the posts, right?

Have you thought about area coating, i.e. moving the dispense line from
wafer center to edge during dispense?

Another approch to ease the situation could be doing spin-off with two
speeds after dispense: One for getting rid of most of the redundant
dispense material, and the second (higher) one for adjusting the layer
thickness.

Best regards,

Norbert Nodes

E-Mail: [email protected],  www.EVGroup.com

-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Sandip Agarwal
Sent: Mittwoch, 24. Oktober 2007 23:59
To: General MEMS discussion
Subject: RE: [mems-talk] Striations during spin-coating

I am not trying to planarize the substrate. I want a coat ~ 0.2-0.5
microns of the polymer on the posts of the substrate. Of course, there
would stuff on the recesses, but that's not a concern.