Hello all!

In order to electroless plate Nickel on a Nickel start layer and obtain
homogenous results I dip the wafers into concentrated HCl/Isoprop mixture to
remove the native oxide before plating. I obtain quite good results with
this procedure but since HCl is quite rough towards a resist layer that is
also on the wafers, I would like to use a softer way to get rid of the
oxide.

Best regards,
Martin