Our group use Pt/Ti layer(1500A/500A thickness) as pad material and the layer
can be bonded with Au wire(30 micron dia.) using normal bonder. But I am not
sure if its durability and reliability are good enough for mass production
process.

minoru
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Minoru Sakata

Central R&D Lab., OMRON Corporation
45 WADAI, TSUKUBA-CITY, IBARAKI,
300-42, JAPAN
PHONE :(+81)-0298-64-4100 (ext.241)
FAX     :(+81)-0298-64-4105
e-mail:[email protected]