I am trying to obtain a good undercut profile of the photoresist to get
a good liftoff.

The thickness of the photoresist needs to be about 6~7microns.
The deposited material is about 3microns thick.

Soaking in chlorobenzene for 30 minutes was not enough to give a good
enough undercut profile for a good liftoff.

Is there anyone who can help me with this?  Is there an alternative to
this process?