To  MEMS

Hello,

My name is Seung-Hyun, Son.
My partner and I are graduate students who are majoring in
electronics, Kyungpook national university in SOUTH KOREA.

150nm thickness of  Pb(Zr,Ti)O3 ferroelectric thin films were
deposited on 4 inch silicon wafer(i.e. PZT/Pb/Ti/Si).
We need to bond this wafer to 4 inch silicon wafer for FRAM
application.

Our questions are :
1. Bonding method  of thin flim PZT -  bulk Si  (anodic? or fusion?
    or other ?)
2. The concrete condition for good bonding?

Thanks,

Seung-Hyun Son
Ph.D Kyungpook national university in SOUTH KOREA
e-mail : [email protected]