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MEMSnet Home: MEMS-Talk: wafer bonding
wafer bonding
2008-04-15
Prem Pal
2008-04-17
Brubaker Chad
2008-04-18
Kvel Bergtatt
2008-04-17
jian zi
2008-04-17
Prem Pal
wafer bonding
jian zi
2008-04-17
Hi Prem,

  I don't know which technique you use to do the boding.

  As I use low temperature bonding technique, After surface activation, standard
RCA-1 clean for 45 seconds would be OK.

  Sincerely,

  Zhijian ZHOU
  Hong Kong University of Science and Technology

reply
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