Hi,

I am working on deposition of Ni on electroplated Cu. The Ni, I have
deposited, has very poor adhesion to electroplated Cu and peels off during
the Cu seed layer etch in Perchloric Acid [HClO4]and Ce (NH4)2(NO3)6
solution. The Ni is deposited by  evaporation. I would like to know:

1. What cleaning and drying step I should perform before evaporation to
improve adhesion ?I only remove the copper oxide in 10% nitric acid before
Ni deposition.

2. The effect of chamber pressure and rate of evaporation on Ni adhesion ?

and 3. Will an intermediate layer of Cr ( ca. 5 - 10 nm) help ?

I hope someone can help me on this !

cheers !

Bilal

TKK, Finland