Funny, I came across this in Madou today. If I remember correctly, it was
around 0.3Å/min in pure HF solution. Principles of Microfabrication by
Madou, in the wet-etching chapter, look it up.


On Sun, Jun 22, 2008 at 4:23 AM, Seongmu Heo  wrote:

> Dear Andrea,
>
> >From my experience in semiconductor fabrication, HF itself hardly etches
> silicon.
> In case of BOE(Buffered Oxide Etchant) which consists of HF and NH4F,
> silicon can be etched due to 'NH4'. It is very slow but I don't have etch
> rate data.
>
> Thanks,
> SM
>