Hello,

I am doing Electroless Cu plating on SiO2 substrate. I found the solution can
deposit Cu film on Si but not SiO2. I tried to use different self-assembly
monolayer to modify the surface, but still not succeed. One thing I am concerned
about the SiO2 substrate cleaned with Pirana solution has contact angle of 45
degree which is different from other reported contact angle (nearly Zero
degree). I don't know how the difference comes.

Appreciate if you share your experience and suggestion.

Regards

Cassie