It's very tough to electroplate copper on an insulator- no electrons for the
redox process. You need an initiator i.e. palladium to do this and the
adhesion to SiO2 is lousy. You will have to evap or sputter if you need a
good stable film.

Shay

-----Original Message-----
From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org]
On Behalf Of Cassie Iany
Sent: Friday, June 27, 2008 6:17 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] Electroless Cu plating

Hello,

I am doing Electroless Cu plating on SiO2 substrate. I found the solution
can deposit Cu film on Si but not SiO2. I tried to use different
self-assembly monolayer to modify the surface, but still not succeed. One
thing I am concerned about the SiO2 substrate cleaned with Pirana solution
has contact angle of 45 degree which is different from other reported
contact angle (nearly Zero degree). I don't know how the difference comes.

Appreciate if you share your experience and suggestion.

Regards

Cassie