Hello.

Assuming, SU-8 layer thickness is the same for both wafer sizes, about 4 times
more solvents is evaporated from a 100mm wafer surface (compared to 2" wafer
size) during bake.
A glass plate underneath the wafer was previously mentioned. This reduces the
bake plate volume between lid and wafer, of course.

You could test a bake with an increase exhaust rate.

Best regards,
Norbert Nodes

E-Mail: [email protected]

-----Original Message-----
From: [email protected] [mailto:[email protected]] On
Behalf Of ???(Ruilin Zheng)
Sent: Dienstag, 08. Juli 2008 02:57
To: General MEMS discussion
Subject: Re: [mems-talk] Islands found during SU-8 soft-bake

Hello, everyone

the hot plate is of about 20cm in diameter, with a metal lid on top, and the
lid roof is about 3cm  from the hot plate.
Do you think it is too close for the lid to hot plate?