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MEMSnet Home: MEMS-Talk: SiN waferbonding
SiN waferbonding
2008-08-13
P.E.M. Kuijpers
2008-08-13
goorsky
2008-08-13
Roger Shile
SiN waferbonding
goorsky
2008-08-13
Hi Peter:

We use SiN-SiN bonding for III-V integration.  A couple of our
references are listed below (with references in those papers to earlier
work).

Hayashi S, Sandhu R, Wojtowicz M, Chen G, Hicks R, Goorsky MS. InGaAs
quantum wells on wafer-bonded InP/GaAs substrates.  Journal of Applied
Physics, vol.98, no.9, 1 Nov. 2005, pp. 93526-1-4.

Hayashi S, Sandhu R, Wojtowicz M, Sun Y, Hicks R, Goorsky MS.
Determination of wafer bonding mechanisms for plasma activated SiN films
with x-ray reflectivity. [Journal Paper] Journal of Physics D (Applied
Physics), vol.38, no.10A, 21 May 2005, pp. A174-8.

P.E.M. Kuijpers wrote:
> Hi all,
>
> Does someone knows articles/recipes for SiN-SiN or SiN-Si waferbonding?
>
> Thanks in advance.
>
> Peter Kuijpers
> MiPlaza
> mailto:[email protected]

--
Mark Goorsky
Professor and Chair
Materials Science and Engineering
University of California, Los Angeles
http://www.seas.ucla.edu/ms/faculty1/goorsky.html


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