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MEMSnet Home: MEMS-Talk: Thermal bonding problem
Thermal bonding problem
2008-09-02
Lin Yu
2008-09-03
Balaji
2008-09-03
Lin Yu
2008-09-04
Balaji
2008-09-03
Brad Johnson
Thermal bonding problem
Balaji
2008-09-03
Hello Lin

You could try to use a graphite or a metal plate of say 2 inch dia and 2mm
thick. This type of arrangement is there in EVG bonding machine.

Balaji
--------

On Wed, Sep 3, 2008 at 1:28 AM, Lin Yu  wrote:

> Hello all,
>
> I was doing some research of bonding two initially aligned Si pieces.
> A homemade thermal bonder has been used, which can provide force
> and heat the samples. However, due to the shear force generated by
> the bonder head on the samples, the initial alignment was broken
> during the bonding. Is there any way that I can reduce the shear force
> to avoid breaking the alignment? Any suggestion is appreciated.
>
> Thanks,
> Lin
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