Hello,

I am doing Indium electroplating on both Gold and copper substrate with Ti
as an adhesion metal.The Ti and Gold/Copper will act as an UBM for
electroplating Indium.

I am looking for Gold and Copper etchants to pattern the UBM by wet chemical
etching after Indium is electroplated.Hence, as you can understand, it
should not attack the electroplated Indium in any way but perform selective
etching of Gold and copper.

I need some help on this.
Your suggestion will be highly appreciated.

---ANIRBAN
Electrical Engineering
Louisiana State University
Baton Rouge
70802,USA