Hello.

A colleague of mine is having a lot of difficulty lifting-off 1um of Al
deposited on a pattern written in a bi-layer of e-beam resist (thickness
1.3 um) that has a minimum feature size of 1 um.

Essentially lift-off is a total failure (he has had the sample in 45oC
acetone for over 2 days).

He has used the standard bi-layer process with PMMA resist to achieve an
overhang profile to aid lift-off.

Any advice would be much appreciated.

Dr. James Paul Grant
Postdoctoral Research Associate
Microsystems Technology Group
76 Oakfield Avenue Room 3
University of Glasgow
Glasgow
Scotland
G12 8LS
Telephone: +44(0)141 330 3374