1 micron of metal on 1.3 microns of resist is really hard. It is
usually better to have at least twice or three times as thick a resist
underneath.

Did he try ultrasonics?

-- Jon

On Thu, Jan 15, 2009 at 11:34 AM, James Paul Grant
 wrote:
> Hello.
>
> A colleague of mine is having a lot of difficulty lifting-off 1um of Al
> deposited on a pattern written in a bi-layer of e-beam resist (thickness 1.3
> um) that has a minimum feature size of 1 um.
>
> Essentially lift-off is a total failure (he has had the sample in 45oC
> acetone for over 2 days).
>
> He has used the standard bi-layer process with PMMA resist to achieve an
> overhang profile to aid lift-off.
>
> Any advice would be much appreciated.
>
> Dr. James Paul Grant

--
Dr. Jon R. Fox
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