Evelyn
How are you preparing the substrate surface before evap?
Shay

-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of Evelyn B
Sent: Thursday, January 15, 2009 9:32 PM
To: [email protected]
Subject: [mems-talk] Adhesion on Alumina

I am having trouble depositing metal stack-ups using either Chrome or
Titanium as an adhesion layer.  There have been instance in which the layers
peeled of during DI cleaning and in other instance the layers on top of the
seed layer delaminated.  I am e-beam evaporating the films around 8 uTorr
and the seed layer thickness is around 50 nm with overall metal thickness
-including ahdesion layer - of 0.85 um.  Has anyone run into a problem like
this?  Can anyone suggest a solution?

EVELYN BENABE