Yinyan,
       It could very well be due to Cr and Pt not having good adhesion
to Boron compounds and that is your problem. However, Ti is also a very
reactive metal and can act as a getting agent by reacting with compounds
so it might be some contamination it is reacting with. HOWEVER, probably
you are right and it is just intrinsic to the metal and the boron
compound involved.

I always like to bring up basic things since they tend to be overlooked.
Anyways you will always want to make sure your systems are clean in any
case. It can save you much pain.

I am glad to hear that you have gotten a good deposition.

Ed

-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Yinyan Gong
Sent: Tuesday, January 20, 2009 3:46 AM
To: General MEMS discussion
Subject: Re: [mems-talk] Deposition of Chromium and Platinum


Dear Edward,

Thanks for your help. I have deposited Ti followed by Au (sputtering
system) on the same substrate and did not have any problem. It seems
that the poor adhesion does not due to contamination from cleaning
process. I will check whether that is because of system contamination. I

am just wondering could that be posssible that Cr or Pt does not have
good adhesion to my substrates which are boron compounds and do not have

excellent crystalline quality? Thank you very much.

Yinyan